$26.38
On Hold
9pcs/set IC Chip BGA Reballing Stencil Kits Mobile Phone Solder Solder Template
5 available
Details
Shipping: Australia: free (more destinations)
Condition: Brand new
Returns: 7 days, buyer pays return shipping (more)
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9pcs/set IC Chip BGA Reballing Stencil Kits Tin Solder Template for Samsung S3 S4 S5 S6 S6 Specifications: Material: stainless steel Dimensions: 19.3*7.8cm/ 7.6*3.07" Application:It is applicable to S3, S4 ,S5 ,S6, S6 surface ,S7 ,note4 ,note5 ,note6.
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